Plan Optik AG is the leading manufacturer of structured wafers when it comes to technology. In sectors such as consumer electronics, automotive, aerospace, chemistry and pharmaceuticals these wafers are essential components used as active elements for numerous applications in MEMS technology. The wafers of glass, glass-silicon compounds or quartz are available in sizes up to 300 mm diameter. Wafers by Plan Optik provide high-precision surfaces. Plan Optik wafers are available to minimum tolerances with application-specific structuring and complex material combinations.
Plan Optik AG's extensive experience in the integration of optical, electronic or chemical functions within a wafer as the basis of MEMS applications has made the company the preferred partner of large international manufacturers. Based on Plan Optik's expert knowledge the wafers are developed in collaboration with customers such as OSRAM, Infineon, Motorola, Samsung, Honeywell and Bosch.
CARRIER WAFERS - Process carriers for the manufacture of ultra-thin substrates of silicon, gallium arsenide and other special materials.
PACKAGING WAFERS - Cap wafers for wafer level packaging up to 300 mm available in various materials and combinations. Applications in consumer electronics, automotive, aerospace, chemistry, pharmaceuticals and semiconductors.silicon vias).
QUARTZ WAFERS - Quartz and fused silica materials
Plan Optik produces carrier wafers as a carrier substrate for the processing of thin semiconductor wafers. These carriers are used to permit the safe handling of delicate semiconductor wafers (e.g. those made of silicon and gallium arsenide).
Plan Optik manufactures packaging wafers from custom-made single items to large-scale series using glass, quartz and silicon and combinations of these three materials. The diameter is 50 - 300 mm with low thickness tolerances and low ttv values. In each case the structuring of the wafer is carried out on a customer-specific basis, for example with optical cavities, coatings and drillings.
Plan Optik manufactures quartz wafers (SiO2) both as single-item production and in large-scale series using both synthetic "fused silica" and "fused quartz" extracted from natural raw materials. In contrast to crystalline quartz, the substance used here is amorphous quartz glass. The diameter is between 50 - 200 mm with low thickness tolerances, high quality surfaces and low ttv values.
Plan Optik AG, the leading manufacturer of glass and quartz wafers, now offers substrates and re-usable carriers for thin wafer handling of gallium arsenide (GaAs), gallium nitride (GaN), silicon carbide (SiC) and indium phosphide (InP) wafers. These substrates from glass do have a coefficient ...| » Further reading
From now on Plan Optik AG, the leading manufacturer of glass and quartz wafers, offers re-usable carriers for thin wafer handling which can be used for chemical release of device wafers. There has been an ongoing wafer thickness reduction in the semiconductor industry since many years. The mark...| » Further reading
Plan Optik AG the leading manufacturer of glass and quartz wafers now offers fused silica wafers from one of the purest materials: ULTRA HIGH PURITY FUSED SILICA. Ultra High Purity Fused Silica has an impurity level (trace metal content) of less than 0.2 ppm. This is the lowest impurity level a...| » Further reading
Plan Optik AG
Über der Bitz 3
Phone: +49 2664 50680
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