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Logo Made in Germany SEMICON Japan 2018

Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM-ASSID

Booth number: 1910

info@assid.izm.fraunhofer.de
www.izm.fraunhofer.de

About us

Fraunhofer IZM is a worldwide leading institute for microelectronic packaging and provides prototyping and low-volume manufacturing services (300/200 mm) at its leading-edge pilot line for WLP. Fraunhofer IZM-ASSID has established strong cooperations with leading material and equipment suppliers in which customer-specific solutions in the field of material, equipment and processes are developed and introduced into products. As a member of the Fraunhofer Cluster 3D Integration, Fraunhofer IZM-ASSID offers fully customized support for 3D integration and 3D SiP including design, technology and reliability.

Core Competencies:

  • Leading-edge wafer level packaging
  • 3D heterogeneous system integration
  • Wafer-level System-in-Packages (WL-SiP)
  • Enhanced interconnection & assembly technologies
  • Customized technology development
  • Customer-specific prototyping & pilot-line manufacturing
  • Process, equipment & material evaluations as well as qualification
  • Process transfer & product integration


Products and services

Wafer processing service for Interposer and assembly process modules (8inch & 12 inch) e.g.

  • TSV-integration including thinning, thin wafer handling & backside contact
  • wafer bumping service and RDL formation service
  • Assembly service incl. pre-assembly (FC, D2W or W2W bonding)

Service for individual processes steps possible too: 

  • e.g. lithographic patterning, thin film, dielectric film materials, galvanic deposition, wafer thinning, blade or stealth dicing, Assembly

Exemplary applications:

  • Healthcare: flexible intelligent devices
  • Imaging: integrated camera & sensor  modules
  • Microfluidic: high performances cooling
Half shelf Silicon Interposer Structure

Half shelf Silicon Interposer Structure

300 mm Silicon Interposer Wafer // CarriCool

300 mm Silicon Interposer Wafer // CarriCool

Performance Silicon Interposer Module with micro-fluidic channels and TSV‘s

Performance Silicon Interposer Module with micro-fluidic channels and TSV‘s

Contacts

Address
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM-ASSID
Ringstr. 12
01468 Moritzburg
Germany

Phone: +49 351 795572-917
Fax: +49 351 795572-19

M. Jürgen Wolf
Head of Devision Wafer Level System Integration // Head of IZM-ASSID
Phone: +49 351 795572-12
wolf@izm.fraunhofer.de


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