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Key-Visual SEMICON Japan 2017

SEMICON Japan 2017

13 – 15 December 2017 – Tokyo, Japan

Meet 16 German companies

Welcome to the German Pavilion at SEMICON Japan 2017!

Semiconductor Equipment & Materials Exhibition

SEMICON Japan 2017
13 – 15 December 2017
Tokyo, Japan

Welcome to the German Pavilion at SEMICON Japan 2017!

Semiconductor Equipment & Materials Exhibition

SEMICON Japan is one of the world's major trade fairs for semiconductor manufacturing. In its 41th year about 500 exhibiting companies from around 20 countries will present the latest trends of this highly innovative industry sector. Japan is still an important player for German machine makers. That is especially true for latest technology and production innovations in the semiconductor sector and electronics as a whole. Major topic discussed this year is the "Internet of things (IoT)" and new innovations from start-ups. Germany has made special progress in applying the IoT to production – also known as "Industry 4.0" and has increased the effort to support start-ups and their innovations in the last years.

Innovative electronics need innovative, cost-effective manufacturing. And this is where German machine makers come in: Equipment "made in Germany" meets highest demands in terms of quality, reliability, safety and environmental standards. It helps manufacturers keeping up with cost-competitiveness, lowest cost of ownership and high quality products at the same time. With long-standing Japanese-German trade relations, Germans show a strong and sustained interest in the very important Japanese semiconductor and electronics environment. SEMICON Japan is an excellent opportunity to showcase the trends and innovations in our industry and is an ideal place to help to strengthen mutual business relations and joint developments between Japanese and German partners.

That's why the German Federal Ministry for Economic Affairs and Energy (BMWi) and the AUMA - Association of the German Trade Fair Industry with support from the German Engineering Federation (VDMA) have once again set up a German Pavilion including an information center at SEMICON Japan.

This time, 16 German exhibitors offer state-of-the-art manufacturing solutions, components, materials, software and services for the production of semiconductors, electronics as well as related fields like photovoltaics. You are cordially invited to visit us and to take the opportunity of experiencing German high-tech engineering. Meet our enablers of electronics production!

We wish you all a very productive and successful visit to SEMICON Japan!

Exhibitors at the German Pavilion


JENOPTIK Optical Systems GmbH
Optics - Experience High Precision
Booth number: 1709-1

UniTemp GmbH
WB-200 Wire Bonder
Booth number: 1709-5

Plan Optik AG
Carrier Wafers
Booth number: 1709-4

MueTec GmbH
MT8000 Series
Booth number: 1709-6

Integrated Dynamics Engineering GmbH
MK5 - EMI Active Compensation for SEM and TEM Microscopy
Booth number: 1609-4

Integrated Dynamics Engineering GmbH
ATAN - Active Vibration Isolation System
Booth number: 1609-4

View all German exhibitors and products

News & Innovations

Ultra high purity fused silica (UV grade fused silica)
Plan Optik AG the leading manufacturer of glass and quartz wafers now offers fused silica wafers from one of the purest materials: ULTRA HIGH PURITY FUSED SILICA. Ultra High Purity Fused Silica has an impurity level (trace metal content) of less than 0.2 ppm. This is the lowest impurity level a... | Further reading

Evaporation System for the Flat Panel X-Ray Detector Film layer Coating
Evaporation System for Flat Panel X-Ray Detector Film layer Coating Flat Panel X-Ray Detector is a rapidly growing technology in X-ray equipment market. In place of the existing film type X-ray, it detects low dose X-ray, and it captures X-ray image. Recently, it is rapidly growing mainly in th... | Further reading

Substrates and Carriers for GaAs, GaN, SiC and InP
Plan Optik AG, the leading manufacturer of glass and quartz wafers, now offers substrates and re-usable carriers for thin wafer handling of gallium arsenide (GaAs), gallium nitride (GaN), silicon carbide (SiC) and indium phosphide (InP) wafers. These substrates from glass do have a coefficient ... | Further reading

News & Innovations
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