Fraunhofer Institute for Electronic Nano Systems ENAS
About us
The Fraunhofer ENAS is the specialist and development partner in the field of smart systems and their integration into a wide range of applications. From the idea via design, technology development or implementation based on existing technologies all the way through to the tested prototype and technology transfer, we are a reliable innovation partner for start-ups, SMEs, and large enterprises.
We cover the individual processes and technologies that lay the basis for the development of electronic structural elements, sensors, and actuators, including their packaging (MEMS and wafer-level packaging and the heterogeneous integration of different components). This work is completed by the design and simulation as well as characterization, test and reliability assessments. Our research and development aim to implement new materials and functional principles on the nano- and microscale.
Our focus is on inertial, optical, RF, acoustic, hybrid and wireless components and systems.
Address
Technologie-Campus 3
09126 Chemnitz
Germany
E-mail: info@enas.fraunhofer.de
Phone: +49 371 45001-0
Internet: www.enas.fraunhofer.de
Akasaka 7-5-56, Minato-ku
German Cultural Center 1F
107-0052 Tokyo
Japan
E-mail: info@fraunhofer.jp
Phone: +81 3 3586 7104
Internet: www.fraunhofer.jp/
Contact person:
Prof. Dr. Stefan Schulz
Chief Scientist
E-mail: events@enas.fraunhofer.de
Products & Services
From Applied Research to Technology Transfer
We concentrate our research activities in five research focuses. They provide the framework within which we systematically further develop our expertise, interlink it, and align it with future needs. In doing so, we combine scientific insights with application-oriented research and address current and future technological challenges. On this basis, we work together with customers and partners to develop new solutions and bring innovative approaches into practical application. Learn more about our services, expertise, and current research topics.
Design, Simulation, and Digital Models for Semiconductor Processes and Devices up to the System Level
Our Range of Services to Support Your Success
Simulation of semiconductor processes
Knowledge-based and data-driven models of semiconductor processes
Material models for optics and electronics
Design and layout of components and systems (MEMS, Beyond CMOS, quantum and photonics, electronics)
Simulation for reliability assessments of electronic assemblies and systems
Design for Test (DfT) and Design for Reliability (DfR)
Wafer Processes for MEMS, Beyond CMOS, Quantum, and Photonic Technologies
Our Range of Services to Support Your Success
Processes and process chains in semiconductor technologies, in particular:
Development and optimization of individual processes, including the integration of new materials
Generic and customer-specific technology modules for device development
Technology platforms for MEMS/NEMS, MOEMS, and photonics
Fabrication of functional prototypes, demonstrators, and small batches
Wafer-Level Packaging and Heterogeneous Integration
Our Range of Services to Support Your Success
Processes and process chains for heterogeneous integration, in particular:
Development and optimization of unit processes, including the integration of new materials
Technology modules for encapsulation using wafer and chip bonding or parylene-based approaches, including contacting systems
Development of packaging and interconnection technologies for integration at the system level
Fabrication of functional prototypes, demonstrators, and small batches
Smart System Integration
Our Range of Services to Support Your Success
Development of complex systems, including electronics for actuation and detection, communication, and energy and data transfer
Development of MEMS, Beyond CMOS, quantum, electronic, and photonic components, as well as edge AI solutions for data processing and analysis
Printed large-area electronics and printed functional layers beyond the wafer level
Functional integration (hardware, software)
Development of functional prototypes, demonstrators, and small batches
Testing, Characterization, and Reliability Assessment from Wafer to System Level
Our Range of Services to Support Your Success
Development of test solutions at the wafer, chip, and component level for MEMS, Beyond CMOS, quantum, electronic, and photonic components
Material characterization
Thermo-mechanical and electrical reliability assessment, as well as Prognostic Health Management (PHM), including the prediction of the system state
Method development, including validation
Service for functional prototypes, demonstrators, and small batches