Fusion Bionic GmbH, located in Dresden, Germany, is a solution provider for laser-based surface functionalization. We develop laser solutions for large-area and high-speed surface processing using Direct Laser Interference Patterning (DLIP).

Our scalable platform technology creates defined micro- and nanostructures directly on silicon carbide, metals, polymers, ceramics, glass, and other technical materials in a fast, contactless, single-step process. Our expertise in material processing enables us to adapt surface properties precisely to the requirements of semiconductor and other high-tech applications.

Our turnkey and customized machine solutions combine coordinated laser and process technology with automation and integrated quality assurance. The systems can be adapted to customer-specific materials, component geometries, and production requirements.

Adjustable structure periods, ranging from the sub-micrometer scale to several tens of micrometers, combined with high processing speeds, allow both precision and industrial throughput to be matched to the application.

Applications include:

• Thermal management

• Increased effective contact area

• Engineered optical properties, including anti-reflection

• Controlled wettability

• Bonding and debonding

• Optimized adhesion

• Improved underfilling

Visit Fusion Bionic at SEMICON West to discover how laser-engineered surfaces and scalable laser-processing solutions can improve the performance of next-generation semiconductor products.