UniTemp GmbH
About us
Since its inception in 2000, UniTemp GmbH is constantly working in the development, manufacturing, sales and marketing of equipment for the semiconductor and microelectronics industry. Key products are single wafer RTP (rapid thermal process) ovens for various wafer sizes (100 mm, 150 mm, 200 mm and 300 mm) and reflow solder systems (up to 300 mm x 300 mm area). Our key competency is the manufacturing of compact and user-friendly table top systems with options and accessories according to customer requirements. We offer high-quality equipment with precise fast ramp up rates and an excellent temperature uniformity.
Address
Luitpoldstr. 6
85276 Pfaffenhofen/Ilm
Germany
E-mail: neumeier@unitemp.de
Phone: +49 8441 787663
Internet: unitemp.de/
Bell stork 1-Building 2F, 2-6-13 Haramachida
194-0013 Machida-City, Tokyo
Japan
E-mail: koichi.kato@unitemp.jp
Phone: +81 42 860-7890
Internet: www.unitemp.jp/
Contact person:
Koichi Kato
President
E-mail: koichi.kato@unitemp.jp
Phone: +81 42 860 7890
Products & Services
UniTemp specializes in compact, high-performance thermal processing solutions for the semiconductor and microelectronics industries. Our product portfolio includes RTP (Rapid Thermal Processing) systems, vacuum reflow soldering systems, and customized thermal processing equipment for a wide range of applications.
We provide high-quality, precise, and user-friendly tabletop systems, with flexible options and accessories tailored to customer requirements. From equipment selection and customization to technical support and after-sales service, UniTemp provides comprehensive solutions to meet diverse customer needs.
Reflow Solder System - RSS
Our products of the RSS series are excellent tools for various solder processes up to 310 mm x 310 mm substrate size and are a great addition to the laboratory furnace for all kind of developers implementing and researching new processes, proto-type research, environmental research purposes and for small pre-series or series.
With precisely controlled fast ramp-up and ramp-down rates, the hot plate offers an excellent temperature distribution and homogenity. Beside standard process gases, like Nitrogen, Oxygen, Forming Gas the system (depends on model) can also be used with pure Hydrogen.
Rapid thermal process oven - RTP/RTA
In our RTPs you have the option to process silicon wafers of different sizes, or insert a graphite susceptor for processing a high range of various parts. Typical applications would be:
soar wafer / photovoltaic applications
crystallization & densification of thin films
oxidation / reduction processes at high purity
activation & defect annealing
rapid thermal oxidation / nitridation
metal & contact alloying / metallization
With precise fast ramp up and ramp down rates and an excellent temperature uniformity our devices are a high quality table top furnance which is a great addition in every laboratory. The opportunity of the usage of 4 gas lines controlled via a mass flow controller and an integrated data logging supports you to find the best process runs for your needs.
