SEMICON Japan 2026Products & Services Reflow Solder System - RSS
Reflow Solder System - RSS
Exhibitor
UniTemp GmbH
Our products of the RSS series are excellent tools for various solder processes up to 310 mm x 310 mm substrate size and are a great addition to the laboratory furnace for all kind of developers implementing and researching new processes, proto-type research, environmental research purposes and for small pre-series or series.
With precisely controlled fast ramp-up and ramp-down rates, the hot plate offers an excellent temperature distribution and homogenity. Beside standard process gases, like Nitrogen, Oxygen, Forming Gas the system (depends on model) can also be used with pure Hydrogen.

Reflow Solder Systems