Our Range of Services to Support Your Success

• Processes and process chains for heterogeneous integration, in particular:

  • Development and optimization of unit processes, including the integration of new materials

  • Technology modules for encapsulation using wafer and chip bonding or parylene-based approaches, including contacting systems

  • Development of packaging and interconnection technologies for integration at the system level

• Fabrication of functional prototypes, demonstrators, and small batches