Fraunhofer IZM's All Silicon System Integration Dresden (ASSID), established in 2010, is an integral part of Fraunhofer IZM, specializing in 3D wafer-level system integration and advanced packaging. ASSID operates a state-of-the-art 300 mm process line based on Cu Through-Silicon Via (TSV) technology, offering tailored development and manufacturing of complex 3D systems.

The process line comprises individual modules for TSV formation, post-processing, assembly, hybrid integration, and 3D stacking, enabling both application-oriented development and the qualification and prototype production of advanced 3D system-in-packages. Typical application areas include artificial intelligence and high-performance computing, quantum technologies, photonic integration, and edge sensor systems. Through flexible collaboration models, ASSID supports industry partners in bringing next-generation heterogeneous integration concepts into practical applications.